雙組份環氧灌封膠在膠液混合后具有操作方便，放熱小，收縮率低，流動性好，易脫泡，也易滲透至細小縫隙等特點，固化物表明堅硬，光亮平滑。適用于電子元器件和線路板的灌封。

            DM-001導熱型環氧膠

 A組份   黑色粘稠液體，密度2.1  稠度10萬cps                        

 B組份   褐色液體，     1.1        稠度100cps左右                               

 可操作時間，（25度 100克 ）     60Min                                                             

 初固時間     （  同上         ）      7h                                                                        

 固化后硬度          大于80Shore D   

 使用溫度             -40到90度                                                                                 

 配膠比例（重量比）5：1                                                                                                

導熱系數              0.8W（m.k)                                                                                            

介電常數              3.2

體積電阻率           1.5

擊穿電壓強           大于25kv\\mm

剪切強度              大于10MPa

固化收縮率           小于0.5%

介質損耗正切         小于0.01