本產品系雙組份硅膠，主要用來高溫灌封或密封，能耐280攝氏度的工作溫度，具有良好的耐候性和密封性能，適用于高溫傳感器等電子器件的灌封等

 DN-037       A （ 白色）：B（淺黃色） 10:1                  混合后稠度       5000

                        固化時間（25度)    15天                                           固化后硬度A     35

                                  （80度）  25分鐘                                         比重       1.35

                                                                                                 抗拉強度  1.0MPa

                                                                                                 剪切強度  1.2MPa

                                                                                                 耐溫范圍  -60到280攝氏度

                                                                                                 導熱系數   0.8W（m.k)

                                                                                                 介電強度   25kv/mm

                                                                                                 線性膨脹率 0.3%